G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G98-1122 - Current SEMI E4-91 (technical revision)

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SEMI E4-91 (technical revision)

and thickness of the gold plating shall be specified per MIL-G-45204 unless otherwise agreed between vendor and customer

本スタンダードは，global Liquid Chemicals Technical Committeeで技術的に承認されている。現版は2012年6月18日，global Audits and Reviews Subcommitteeにて発行が承認された。2012年8月にwww

3 This Standard defines only horizontal and vertical viewing angles for measurement

G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G98-1122 - Current SEMI E4-91 (technical revision)Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of

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