G00900 - SEMI G9 - 仕様　スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム StdPbc-0118 Mask-making techniques and materials used

Mask-making techniques and materials used in lithography: Techniques & materials used in mask-making & various lithographic methods (DUV

The purpose of this document is to provide a permanent withdrawal notice for SEMI S9 indicating that all technical content has been incorporated within SEMI S22

This test is not a valid method for predicting the flashing performance in all mold types

and fixed or trapped charge distributed within the oxide

G00900 - SEMI G9 - 仕様　スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム StdPbc-0118 Mask-making techniques and materials usedReferenced SEMI Standards SEMI G4 Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes SEMI G10 Standard Method of Mechanical Measurement SEMI G21 Specification for Plating Integrated Circuit Leadframes